Rapidus Signs UK and Italy Chip Research Deals, June 12

Rapidus Corporation announced research partnerships with public institutions in Britain and Italy on June 11, with agreements to be signed during Prime Minister Sanae Takaichi’s European visit. The company aims to mass-produce leading-edge 2-nanometer semiconductors by fiscal 2027 and is in talks with over 60 firms, mainly in the United States, to secure customers. Japan’s government has committed ¥2.4 trillion ($15 billion USD) in total aid to support the effort.

Partnerships Span UK and Italy

Rapidus will exchange memorandums of understanding with the UK Semiconductor Centre and Fondazione Chips-IT, an Italian government research institute. The agreements focus on cooperation in technologies and research for cutting-edge semiconductor production. Prime Minister Takaichi said at the June 11 meeting: “I hope to promote related efforts, mainly among like-minded nations.”

Government Support for Market Development

The Japanese government will back Rapidus’ efforts to develop sales channels in Britain and Italy. Rapidus President Atsuyoshi Koike told Takaichi the company would “work hand-in-hand with Europe to make the first step toward the discovery of a new world and new technologies that have never been seen before.” The courtesy call occurred at the Prime Minister’s Office in Tokyo on June 11.

Customer Pipeline and Production Timeline

Rapidus is currently in talks with more than 60 companies, mainly in the United States, to lock in customers for its advanced chips. The company targets the start of mass production of 2-nanometer chips in fiscal 2027. Analysts at Morgan Stanley raised their price target to reflect confidence in Japan’s semiconductor strategy as a hedge against supply chain concentration in Taiwan and South Korea.

Final Thoughts

Rapidus’ European partnerships represent Japan’s shift toward building allied chip supply chains outside Asia. With ¥2.4 trillion in government backing and over 60 customer discussions underway, the company is positioning itself to compete in advanced semiconductor production by 2027.

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