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ChipMOS TECHNOLOGIES Inc.

CPIA.F•XETRA
Technology
Semiconductors
€15.40
€0.10(0.65%)

ChipMOS TECHNOLOGIES Inc. (CPIA.F) Stock Overview

Explore ChipMOS TECHNOLOGIES Inc.’s financial performance, market position, analyst ratings, and future outlook.

Meyka AI Score

B

Score: 68.1/100

Key Financials

Market Cap552.3M
P/E Ratio16.10
EPS (TTM)$1.15
ROE0.05%
Fundamental Analysis

AI Price Forecasts

1 Week$15.64
1 Month$15.69
3 Months$13.00
1 Year Target$19.12

CPIA.F Stock Analysis & Investment Overview

Our comprehensive AI-powered analysis of ChipMOS TECHNOLOGIES Inc. (CPIA.F) provides investors with deep insights into the stock's performance, growth potential, and market positioning. With a Meyka AI Score of B, this stock demonstrates moderate investment characteristics based on our advanced machine learning models.

The current technical analysis reveals key indicators including an RSI of 46.53, suggesting the stock is in a neutral condition. Our forecasting models predict significant price movements, with a 12-month target of $19.12.

Key financial metrics showcase the company's fundamental strength, including a P/E ratio of 16.10 and a market capitalization of 552.3M. These metrics, combined with our AI analysis, provide a comprehensive view for both institutional and retail investors.

Technical Indicators

46.53RSI (14)
-0.19MACD
15.84ADX
Revenue Growth
6.27%
↑ 6.27%
Profit Growth
€32.66
↓ 26.84%
EPS Growth
€32.66
↓ 26.94%
Operating Margin
6.31%
↓ 33.25%
ROE
4.77%
↓ 26.84%
Dividend Yield
0.00%
↓ 21.74%
Analyst Recommendations data is not available for CPIA.FAnalyst Recommendations details for CPIA.F are currently unavailable. We're actively monitoring for updates and will publish them as soon as they’re released. Please check back again shortly.

Company Profile

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

CEO

Shih-Jye Cheng

Headquarters

No. 1, R&D Road 1, Hsinchu City

Founded

2018

Frequently Asked Questions

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