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BE Semiconductor Industries N.V.

BESI.AS•EURONEXT
Technology
Semiconductors
€127.15
€-0.25(-0.20%)

BE Semiconductor Industries N.V. (BESI.AS) Stock Overview

Explore BE Semiconductor Industries N.V.’s financial performance, market position, analyst ratings, and future outlook.

Meyka AI Score

B+

Score: 74.2/100

Key Financials

Market Cap10.1B
P/E Ratio56.12
EPS (TTM)$2.26
ROE0.38%
Fundamental Analysis

AI Price Forecasts

1 Week$104.83
1 Month$122.55
3 Months$88.98
1 Year Target$165.85

BESI.AS Stock Analysis & Investment Overview

Our comprehensive AI-powered analysis of BE Semiconductor Industries N.V. (BESI.AS) provides investors with deep insights into the stock's performance, growth potential, and market positioning. With a Meyka AI Score of B+, this stock demonstrates moderate investment characteristics based on our advanced machine learning models.

The current technical analysis reveals key indicators including an RSI of 61.53, suggesting the stock is in a neutral condition. Our forecasting models predict significant price movements, with a 12-month target of $165.85.

Key financial metrics showcase the company's fundamental strength, including a P/E ratio of 56.12 and a market capitalization of 10.1B. These metrics, combined with our AI analysis, provide a comprehensive view for both institutional and retail investors.

Technical Indicators

61.53RSI (14)
2.38MACD
23.21ADX
Revenue Growth
4.94%
↑ 4.94%
Profit Growth
€2.27
↑ 2.77%
EPS Growth
€2.27
↑ 1.32%
Operating Margin
32.07%
↓ 8.34%
ROE
37.51%
↑ 2.77%
Dividend Yield
0.00%
↓ 24.11%
Analyst Recommendations data is not available for BESI.ASAnalyst Recommendations details for BESI.AS are currently unavailable. We're actively monitoring for updates and will publish them as soon as they’re released. Please check back again shortly.

Company Profile

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

CEO

Richard W. Blickman

Employees

1,820

Headquarters

Ratio 6, Duiven

Founded

1998

Frequently Asked Questions

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